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TE CONNECTIVITY 2317857-2

Dust Cap / Cover, Dust & EMI Cover, AMP OSFP I/O Connectors, Zinc Alloy Body

TE CONNECTIVITY 2317857-2

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Manufacturer Part No:
2317857-2
Order Code:
2946012
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Product Overview

TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps
  • Applications: Servers, Switches, Storage Devices, Routers etc.

Applications

Communications & Networking, Data , Computing, Industrial, Telecommunications

Product Information

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Dust & EMI Cover

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AMP OSFP I/O Connectors

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Zinc Alloy Body

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Technical Documents (4)

527 In stock Need more?

527 deliver in 3-4 business days from our UK warehouse

Due to market conditions delivery times are for general guidance only and may be subject to change at short notice

¥1,214.37 ( ¥1,335.81  Inc. JCT)

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10+ ¥1,061.88 (¥1,168.07)
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70+ ¥971.72 (¥1,068.89)
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140+ ¥926.09 (¥1,018.70)
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