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MARTIN SMT VD90.5004
Solder Pellets, for BGA Reballing, 0.25 mm, 183 °C, 3.5 g
- Manufacturer:
- MARTIN SMT MARTIN SMT
- Manufacturer Part No:
- VD90.5004
- Order Code:
- 2352939
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- Technical Datasheet:
- VD90.5004 Datasheet
- ECAD / MCAD
-
Product Information
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- :
- 63, 37 Sn, Pb
- :
- -
Technical Documents (2)
Product Overview
The VD90.5004 is a leaded Solder Sphere optimal to use for reballing of BGA and CSP chips. It's material composition equals standard alloys in electric manufacturing (leaded: Sn63Pb37). Hence, processes parameter for i.e. reflow can be used for reballed SMDs in same manner as for new ones. As a result of a special and unique manufacturing procedures, solder spheres have best surface quality and repeatable sphere shape. Both are important parameter for easy usage with stencils and stable reballing processes. To keep the wetting properties at its best, also on the used pads, MARTIN solder spheres are packed, stored and delivered under dry and inert (oxygen free) Argon gas. By this the creation of the unwanted oxide onto the sphere surfaces is suppressed, Therefore the number of voids is little in solder joints and the electrical properties are very good.
- Compatible with leaded and lead-free alloys
- 99.9% purity
Applications
Maintenance & Repair, Industrial
No Longer Stocked
Due to market conditions delivery times are for general guidance only and may be subject to change at short notice
¥26,538.97
(
¥29,192.87
Inc. JCT)
Pricing is unavailable. Please contact customer services.
- Price for:
- Pack of 50000
Multiple: 1 Minimum: 1
- 1+
| Quantity | Price (Incl JCT) | Your Price (Incl JCT) |
|---|---|---|
| 1+ | ¥26,538.97 (¥29,192.87) | ( ) |
| Quantity | Price (Incl JCT) | Your Price (Incl JCT) |
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