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CHIP QUIK SMDLTLFP10T5
Solder Paste, Synthetic No Clean, 138 °C, 42, 57.6, 0.4 Sn, Bi, Ag, 35G
- Manufacturer:
- CHIP QUIK CHIP QUIK
- Manufacturer Part No:
- SMDLTLFP10T5
- Order Code:
- 3549316
-
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- Product Range
- -
- Technical Datasheet:
- SMDLTLFP10T5 Datasheet
- ECAD / MCAD
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Product Information
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- :
- Synthetic No Clean
- :
- 42, 57.6, 0.4 Sn, Bi, Ag
- :
- 138°C
- :
- 35g
- :
- 1.23oz
- :
- -
Technical Documents (1)
Product Overview
No-clean, lead-free, low temperature solder paste in syringe applicator with plunger and tip.
- Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate components
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Alloy: Sn42/Bi57.6/Ag0.4
- Shelf life:
6 months (refrigerated), 2 months (unrefrigerated)
No Longer Stocked
Due to market conditions delivery times are for general guidance only and may be subject to change at short notice
¥6,974.78
(
¥7,672.26
Inc. JCT)
Pricing is unavailable. Please contact customer services.
- Price for:
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Multiple: 1 Minimum: 1
- 1+
| Quantity | Price (Incl JCT) | Your Price (Incl JCT) |
|---|---|---|
| 1+ | ¥6,974.78 (¥7,672.26) | ( ) |
| Quantity | Price (Incl JCT) | Your Price (Incl JCT) |
|---|
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