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BERGQUIST BOND PLY TBP 850
Thermal Insulator, Bond-Ply 100 .008", 12" x 12" Sheet, 0.8 W/m.K, 6 kV, 0.203 mm
- Manufacturer:
- BERGQUIST BERGQUIST
- Manufacturer Part No:
- BOND PLY TBP 850
- Order Code:
- 1893438
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- Technical Datasheet:
- BOND PLY TBP 850 Datasheet
- ECAD / MCAD
-
Product Information
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Technical Documents (2)
Product Overview
The BP100-0.008-00-1212 is a 0.008-inch Thermal Insulator used in bond-ply products requires the use of dual liners to protect the surfaces from contaminants. Bergquist recommends a 6-month shelf life at a maximum continuous storage temperature of 35°C or 3-month shelf life at a maximum continuous storage temperature of 45°C, for maintenance of controlled adhesion to the liner. The shelf life of the bond-ply material, without consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at 12 months from date of manufacture at a maximum continuous storage temperature of 60°C. It is suitable for mount heat sink onto BGA graphic processor or drives processor and mounts heat spreader onto power converter PCB or onto motor control PCB applications.
- Fibre-glass reinforced pressure sensitive adhesive tape
- High bond strength to a variety of surfaces
- Double-sided
- High performance, thermally conductive acrylic adhesive
- Can be used instead of heat-cure adhesive, screw mounting or clip mounting
Applications
Thermal Management
26 In stock Need more?
26 deliver in 3-4 business days from our UK warehouse :(UK stock) Order before 17:00 Mon-Fri (excluding National Holidays)
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Extra stock is available upon order to the Supplier Lead Time which is approximately 6/16/25
26 deliver in 3-4 business days from our UK warehouse
Due to market conditions delivery times are for general guidance only and may be subject to change at short notice
¥11,209.63
(
¥12,330.59
Inc. JCT)
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| Quantity | Price (Incl JCT) | Your Price (Incl JCT) |
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| 1+ | ¥11,209.63 (¥12,330.59) | ( ) |
| 5+ | ¥9,928.25 (¥10,921.08) | ( ) |
| 10+ | ¥8,984.22 (¥9,882.64) | ( ) |
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